Thermal Reliability of Power Semiconductor Device in the Renewable Energy System
Rui Du, Yaoyi Yu, Gaoxian Li, et al.
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ca. 149,79 €
Naturwissenschaften, Medizin, Informatik, Technik / Elektronik, Elektrotechnik, Nachrichtentechnik
Beschreibung
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
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Schlagwörter
Thermal parameters monitoring, Thermal management, Junction temperature estimation, Thermal Reliability, Failure mechanism, Lifetime evaluation